30g/50g/100g 138°C Low Melt BGA Tin Solder Paste Lead-free Syringe Liquid Flux

Description

Features:
100% brand new high quality
Made of high-quality materials for durability
Essential materials for PCB board maintenance. Suitable for cardboard that cannot withstand high temperature or other special welding.
Lead-free and environmentally friendly, low melting point, discontinuous tinning, and no displacement.
The stickiness is long-lasting, easy to dry, and the sticky time is more than 48 hours.
Product parameters:
Model: WNB 138℃ Flux Paste
Composition: Sn42Bi58
Particles: 4um
Material: solder paste material
Capacity: 30g/50g/100g (optional)
Wettability: Good wettability and high reliability.
Function: It can effectively prevent printing collapse and preheating.
Environmental performance: colorless and transparent, does not affect detection, excellent cleaning and cleaning performance.
Storage: The product has strong wettability, strong resistance to drying, and has a long shelf life at room temperature.
Package Included:
1 * Solder Paste Syringe (1 Solder Paste, 1 Pin, 1 Pusher)
Note:
1.The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
2.Please allow slight manual measurement deviation for the data.