AMTECH 4300/LF-4300-TF Lead-free Universal Water-washable Tacky Solder Flux 30cc

Description

IN STOCK TODAY - Exp. Date: Jan 09, 2022 or later
AMTECH 4300/LF-4300-TF Lead-free Universal Water-washable Tacky Solder Flux
The joy of saving a couple of dollars may easily turn into grief due to outdated, repackaged or fake flux being sold on eBay pretending to be
AMTECH
- don't risk you time, money and short circuits due to bad flux - when you buy from an
AMTECH
trained flux reseller like us you are guaranteed to receive genuine
AMTECH
product with fresh manufacturing date - strong flux with maximum shelf life for your best soldering results.
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Highlights
REL0 flux classification
Optimized for lead-free and standard alloy systems
Wide process window
Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)
Excellent wetting compatibility on most board finishes
Low voiding, Including LGA
REACH compliant
Application
4300/LF-4300-TF
is formulated for a syringe, stencil printing, and rework applications on all PCB surface finishes. 4300/LF-4300-TF is widely used for BGA sphere attachment and reballing. 4300/LF-4300-TF is also designed to work on all Flip Chip Bumping and Chip Scale Packaging sites.
Cleaning
4300/LF-4300-TF is a water washable tacky flux that can be left on the board for many SMT assemblies. For applications requiring cleaning, 4300/LF-4300-TF can be cleaned using de-ionized water at 40-60°C with a recommended water pressure of 30-50 PSI. 4300/LF-4300-TF can also be cleaned using commercially available flux residue removers.
Storage and Handling
Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12-month shelf life.
Recommended Profile
This profile is designed to serve as a starting point for process optimization using 4300/LF-4300-TF. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to < 60 seconds.
Safety Notice
This product is designed for a professional audience. The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers of AMTECH products should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.
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